Energy conditioner with tied through electrodes

ABSTRACT

The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 12/906,762,filed Oct. 18, 2010, which is a continuation of application No.11/817,618, filed Aug. 31, 2007, now issued as U.S. Pat. No. 7,817,397,which is a U.S. National Stage Application of International ApplicationPCT/US06/06608, filed Feb. 27, 2006, which claims the benefit ofprovisional Application No. 60/661,002, filed Mar. 14, 2005, andprovisional Application No. 60/656,910, filed Mar. 1, 2005, andprovisional Application No. 60/671,107, filed Apr. 14, 2005, andprovisional Application No. 60/674,284, filed Apr. 25, 2005.

The following applications are each incorporated by reference herein:application Ser. No. 12/906,762, filed Oct. 18, 2010, application Ser.No. 11/817,618, filed Aug. 31, 2007, now issued as U.S. Pat. No.7,817,397, International Application PCT/US06/06608, filed Feb. 27,2006, provisional Application No. 60/661,002, filed Mar. 14, 2005,provisional Application No. 60/656,910, filed Mar. 1, 2005, provisionalApplication No. 60/671,107, filed Apr. 14, 2005, and provisionalApplication No. 60/674,284, filed Apr. 25, 2005.

FIELD OF USE

This disclosure relates to energy conditioner structures.

BACKGROUND

There is a need for effective noise filtering in electronic devices.There is also a need for electronic components that reduce the number oftotal components and connections to perform electronic device functions,to reduce cost and improve reliability.

SUMMARY

This disclosure addresses the foregoing needs by providing novelstructures including novel conductive layer structures and arrangements,novel conductive layering sequences, novel energy conditioners anddecoupling capacitors, novel energy conditioner packaging, novelconductive pad, via, and pad and via combination configurations, andnovel arrangements of decoupling capacitor or energy conditioner bandswith configurations of conductive pad, via, and pad and viacombinations.

The novel structures of a new embodiment are effective as decouplingcapacitors for power distribution systems (PDS) as well as effective asenergy conditioners for suppressing noise. Certain embodiments of thenovel decoupling capacitors and energy conditioner structures arediscrete components designed for connection to mounting structure(s) onboards, such as PC boards, to first level interconnects, and tosemiconductor chips, such as integrated circuits. Other embodiments aredesigned as integrated parts of a PC board, first level interconnects,or semiconductor chips, such as an integrated circuit.

The term energy conditioner is used herein below to refer to structureshaving both decoupling and noise suppression functions.

A, B, and G Master Electrodes:

The novel energy conditioners all include at least three internal masterelectrodes, A, B, and G master electrodes, each of which includeselectrically conductive material. As described in more detail below, thenovel energy conditioners are designed to provide split and separatedroutes that facilitate a cross-over of paths for portions of energyflowing through main body electrodes of at least two of the three masterelectrodes. Preferably cross-over pathways are created by positioning ofat least two sets of complementary tab portions at edges of main bodyelectrodes. The first set of complementary tab portions are part of mainbody electrodes of the A master electrode. The second set ofcomplementary tab portions are part of main body electrodes of the Bmaster electrode. A and B tab portions along a first edge of thestructure are conductively tied together. A and B tab portions along asecond edge of the structure are conductively tied together. Between thetwo edges, conductive paths in the A master electrode cross conductivepathways in the B master electrode.

The conductive ties may be effected by a conductive band formed onto theside of the energy conditioner, or by conductive connection of bandseach of which is connected to only one of the A or B electrodes viaexternal solder, conductive paste, or by conductive connection of bandseach of which is connected to only one of the A or B electrodes viaconductive connection of multiple such bands to the same conductivemounting pad.

In most embodiments, a majority of the area of the G master electrodeshields a majority of the area of the A master electrode path from amajority of the area of a B master electrode path.

Certain embodiments also provide a combination of energy conditionersand connections to mounting structures of first level interconnects,such as a PC board, substrates, IC packages, IC chips, etc., providingat least on the energy conditioner at least three points of conductiveconnection to the conductive elements of a mounting structure, and inwhich the energy conditioner has at least three internal masterelectrodes, A, B, and G.

An important aspect of certain embodiment is the combination of energyconditioner external conductive bands, particularly for (1) energyconditioners having more than three conductive bands and (2) a mountingstructure having no more than four surface mounting structure conductiveelements (conductive pads, conductive lined via(s) orconductively-filled vias, or the like) to which said energy conditionerstructure mounts, such that two or more of the conductive bands of theenergy conditioner both contact the same conductive surface mountingstructure. This allows the conductive connection of the bands to theenergy conditioner to conductively tie tabs of the A master electrode totabs of the B master electrode. It should be noted that the surfacemounting structure may include additional conductive elements locatedremote from where one energy conditioner is mounted in order to mountadditional circuit elements, such as additional energy conditioners,thereto.

Inside each energy conditioner, the A, B and G master electrodes areconductively isolated from one another. Tabs of the A and B masterelectrodes may be conductively tied together by manufacturing processesthat adds conductive termination structure located and attached to theouter surface of an energy conditioner. This will create a configurationwherein the G master electrode is conductively isolated from both the Amaster electrode and the B master electrode, and the A master electrodeand the B master electrode are conductively connected at the conductivetermination structure.

A-G and B-G Overlap Regions

Preferably, the A, B, and G master electrodes each include at least onemain body electrode. Each main body electrode has major surfaces, andthe major surfaces of all of the main body electrodes are substantiallyparallel with one another. Moreover, substantial portions of the A mainbody electrodes and G main body electrodes overlap one another.Moreover, substantial portions of the B main body electrodes and G mainbody electrodes overlap one another.

Preferably, each main body electrode of any one master electrode has theshape of a layer.

Each main body electrode of the A, B, and G master electrodes has anarea for each of its major surfaces. Preferably, the area of the majorsurfaces of the main body electrodes of the A and B master electrodes isless than or equal to the area of the major surfaces of the main bodiesof the G master electrodes.

Preferably, each main body electrode has the shape of a layer. Althoughthe main body electrodes need not be layers, the description belowrefers to the A, B and G main body electrodes as the preferred structureof layers, A, B, and G layers, for convenience. However, the inventorscontemplate that the more general main body concept may be substitutedwherever reference appears to layers of any one of the A, B, and Gmaster electrodes.

A, B Layer Tab Portions

The A master electrode layers, also called A layers, are defined aslayers with generally the same shape as one another.

The B master electrode layers, also called B layers, are defined aslayers with generally the same shape as one another.

A layers each have at least two tab portions and a main body portion.Preferably the tab portions of the A layers are relatively smallcompared to the non-tab main body portion of the A layers. The tabportions of the A layers are those portions of the A layers that extendbeyond perimeter portion(s) of G main-body layers.

B layers each have at least two tab portions and a main body portion.Preferably the tab portions of the B layers are relatively smallcompared to the non-tab main body portions. The tab portions of the Blayers are those portions of the B layers that extend beyond perimeterportion(s) of G main-body layers. Preferably, the tab portions extend inthe plane of the layer.

Preferably, the tab portions of the A layers do not overlap the tabportions of the B layers in the dimensions of the plane in which thelayers extend. Preferably, in the direction of the planes of the majorsurfaces of the A and B layers, there is a non-zero distance separatingtab portions of A layers adjacent tab portions of B layers.

Preferably, tab portions of the A layers that are adjacent tab portionsof the B layers, are separated there from by a non-zero distance.

The G master electrode has at least one G many body electrode.Preferably, the G main body electrodes are in the form of G main bodylayers.

Preferably, one or more G main body layers extends in the plane definedby a major surface beyond the perimeter of the main-body portions of Aand B layers (and any other layers). Alternatively, the main bodies ofthe G layers may be co-extensive with the main bodies of the A and Blayers.

The G layer also has at least first and second tab portions. Preferably,the first and second tabs of the G layer are relatively small comparedto the area in which the G layer overlaps either the A layer or the Blayer.

Preferably, the tab portions of the A and B layers (and tabs of anyother layers) extend beyond the perimeter of the main bodies of the Glayers.

There is a setback relationship between the extension of the G layersand the separation of the layers defined by setback=VD/HD (verticaldistance divided by horizontal distance). HD is a distance in the planeof the major surfaces between a point on the perimeter of the main bodyof any one G main-body electrode and the closes point on the perimeterof the main body of any one A or B main-body electrode. VD is theshortest distance separating a G main body layer from an A or B mainbody layer.

Preferably, the setback ratio, VD//HD may be as low as zero or as highas 200. Setback may attain any real, fractional, or integer value therebetween, such as 0.5, 1, 1.233, 2, 3, 3.5, etc.

Main-Body Overlap Regions

Preferably, in the region of main body overlap with the G layers, thelayers of the A, B, and G master electrodes do not directly contact oneanother (A main bodies do not contact each other or main bodies of B andG), and there is no conductive path in the overlapped region connectingany structure of the A, B, and G master electrodes to one another.Alternatively, A main bodies may be interconnected to one another in theoverlap region, and/or B main bodies may be interconnected to oneanother in the overlap region, and/or G main bodies may beinterconnected to one another in the overlap region.

Tying of A and B Master Electrodes

The energy conditioner is designed so that (1) a first tab of a layer ofthe A master electrode (A layer) and a first tab of a layer of the Bmaster electrode (B layer) can be electrically connected by a portion ofa conductive path at a location outside the overlapped regions of themain bodies and (2) a second tab of the same A layer and a second tab ofthe same B layer can be electrically connected to one another at alocation outside the overlapped regions of the main bodies. An outerelectrode terminal is one such example of a connection that is outsidethe overlapped region.

The conductively connecting of various tabs of different conductivelayers which provides a conductive path between tabs which does not passthrough the overlapped regions is referred to herein as tying. Forexample, conductive connection of the first tab of the A layer and thefirst tab of the B layer, as just describe, are tied together.

An A conductive path in the A layer extends from the first tab of the Alayer through the region in which the A layer overlaps with the G masterelectrode to the second tab of the A layer. These tabs are in a positionoffset, relative to one another. The off set position of a tab pairallows energy to transverse the electrode layer in a non-direct manner.For example in FIG. 1A tab 2 is located on the opposite side and offsettab 11. For energy entering from tab 2 of electrode layer 1 of FIG. 1A,it must angles across to egress tab 11.

Also, a B conductive path in the B layer extends from the first tab ofthe B layer through the region in which the B layer overlaps with the Gmaster electrode to the second tab of the B layer. Like FIG. 1A above,these tabs 21 and 22 of FIG. 1B are in a position offset, relative toone another. The off set position of a tab pair allows energy totransverse the electrode layer in a non-direct manner. For example inFIG. 1B tab 21 is located on the opposite side and offset tab 22. Forenergy entering from tab 21 of electrode layer of FIG. 1 b, it mustangles across to egress tab 22.

In almost all embodiments, the complementary positioning of A and Belectrode layers and their tabs allows for an A conductive path thatoverlaps with a B conductive path, such that the A and B conductivepaths inside the energy conditioner cross over one another. Preferably,all A conductive paths in the A layer overlap any B conductive path inthe B layer, such that all A and B conductive paths inside the energyconditioner cross over one another.

As a result of the conductive tying of the adjacent first tabs of the Aand B layer to one another, and the cross over of A and B paths, energypassing through the A layer inside the conditioner must cross over the Blayer, and vice versa. By conductive tying of the adjacent second tabsof the A and B layer, the configuration creates a balanced, tiedstructure. In addition, the tying results in uniform distribution ofenergy flow between the A layer and the B layer.

Preferably in many instances, the contacting elements from the mainbodies of the A, B, and G master electrodes to the circuit board, firstlevel interconnect, or semiconductor conductive pathways are as wide ascan be designed without shorting or arcing to one another, to providerelatively low impedance, particularly a relatively low ESR and ESL.

Moreover, ESR can be affected, as needed, based upon size and shape ofcertain elements. Wider tabs at the points of coupling to outer bandswill decrease component ESR to provide relatively low impedance for anenergized circuit, particularly a relatively low contribution to theoverall circuit ESL.

For example, for FIG. 4H, the wider outer band terminals generallyprovide lower internal resistance than narrower outer band terminals.For another example, compare FIG. 4A to FIG. 4L, in which the relativelywider cap shaped bands in FIG. 4L, corresponding in shape to cap shapedbands 401A, 402A in FIG. 4A, provide relatively lower resistance,assuming the same band thickness and band material resistivity. Thus,novel energy conditioners can be designed with tradeoffs betweenrelative ESR and ESL of pathways with circuit design specifications ofsystem impedance in mind.

Embodiments may have multiple A master electrode layers and multiple Bmaster electrode layers. In embodiments having multiple A and B layers,preferably all first tabs are designed to be tied to one another and allsecond tabs are designed to be tied to one another. However, each A or Blayer may have additional tabs, such as third tabs and fourth tabs (ormore tabs) and in these embodiments, all third tabs are designed to betied to one another and all fourth tabs are designed to be tied to oneanother. In the more than two tabs per layer embodiments, each set of atleast two tabs tied together are designed to provide cross over in themanner defined above.

In embodiments having more than type A and B layers, such as A, B, C,and D layers, pairs of type of layers, such as the A, B pair and the C,D pair, are designed to provide crossover and tying.

The first tabs of layers of each G master electrode are conductivelyconnected to one another, either by a conductive band, almost anyconductive material, or a shapeable conductive material which serves asan outer electrode terminal. By way of the now attached electrodeterminal, the first tabs of layers of each G master electrode areconductively connected to a conductive element of the mounting structure(of a PC board, first level interconnect, or semiconductor chip) orequivalent structure inside a first level interconnect or semiconductorchip, such as conductively filled vias, conductive pads, conductivelines, or the like. Conductive material for example, such as but notlimited to solder, solder paste, shapeable conductive material, reflowsolder compounds, conductive adhesives may also electrical connect theelectrode terminal that connects the first tabs of the G masterelectrode to a conductive mounting structure or conductive mountingsurface. The second tabs of each G master electrode are similarlyconductively connected to one another and to a mounting surface or theequivalent as the first tabs of each G master electrode were justdescribed.

In any specific embodiment in which there exist more than one A layerand more than one B layer, preferably the first tabs of the A layers arealigned in the direction perpendicular to the plane defined by any ofthe major surfaces. Preferably, the second tabs of A layers aresimilarly aligned (although the first set of tabs of the A layers areoff-set in alignment to the second set of tabs of the A layers). Thefirst tabs of the B layers are similarly aligned, and the second tabs ofthe B layers are similarly aligned with the first set of tabs of the Blayers are off-set in alignment to the second set of tabs of the Blayers). This arrangement also allows first tabs of both A & B layer(s)to be adjacent to one another yet separated by a gap before theapplication of an outer electrode terminal completes tying of theadjacent A and B tabs to one another.

The layers of the A, B, and G master electrodes are separated from oneanother by one or more conductively insulating materials, including forexample, almost any type of dielectric material possible, such as butnot limited to X5R, X7R, NPO, Metal-oxide Varistor material, air,ferrite, un-doped semiconductor, etc.

One significant aspect of the novel energy conditioners is that they canbe inserted into a single path in a circuit, such as a line from asource of power to active circuitry wherein, inside the conditioner, thesingle pathway is split into at least two pathways (an A main bodypathway and a B main body pathway) wherein the two internal pathwayscross over one another. A second significant aspect of the novel energyconditioners is the ability to allow for an internal cross over ofenergy utilizing the A and B main body pathways that will occur in aregion in which the A main bodies are shielded by the G master electrodefrom the B main bodies when energized.

A third significant aspect of the novel energy conditioners is that thepathway through the A and B master electrodes from the first tabs to thesecond tabs is substantially perpendicular to the pathway between thefirst tabs to the second tabs of the G master electrode. One way todefine this relationship is that a first line from the first A tab tosaid second B tab crosses a second line from the first G tab to thesecond G tab at a crossing angle of at least 45 degrees, or at least 70degrees, or at least 80 degrees, and preferably about 90 degrees. Incontext, about 90 degrees represents the fact that directions of thefirst and second line segments in any embodiment depend upon thestarting point along the width of the tab regions where those linesterminate.

Generic Structural Designs for Tying

There are many generic alternative designs for tying, some of which aredetailed, as follows.

In a first alternative design, the energy conditioner includes a firstconductive band and a second conductive band. The first conductive bandand the second conductive band do not physically contact one another,and they each have a surface forming part of the external surface of theenergy conditioner. The first conductive band is conductively contactedto the first tab of the A layer and to the first tab of the B layer totie the first tabs together and (2) the second conductive band isconductively contacted to a second tab of the A layer and to a secondtab of the B layer to tie the second tabs together.

In a second alternative design, tabs are tied directly to a circuitconnection without the intermediate conductive terminals. For example,one such design has no first or second conductive band, per se. Thesestructures are designed with tabs of the A layer and the B layer sothat, when the energy conditioner is in place for mounting on a mountingstructure or mounting surface of a structure, solder, conductive pasteor other shapeable conductive material can be placed to conductivelyconnect and tie the first tabs of the A and B layers to one another andalso to the mounting structure or mounting surface of a structure.Similarly, for the second tabs of the A and B layers. Similarly, tabconnections of the respective G tabs may be conductively connected toanother conductive structure, a conductive structure not conductivelyconnected to any of the A and B connections.

In a third alternative design, the A, B, and G layers are formed as anintegral part of a semiconductor chip, such as in integrated circuit, oras an integral part of a first level interconnect, and conductivelyfilled vias or the like replace the aforementioned conductive bands orterminals, but directly conductively coupled with solder, conductivepaste, or other shapeable conductive material. In this alternative, theequivalent to the elements of the mounting structure are conductiveconnections of tabs and/or internal via portions within a device toouter conductive pathways extending away in any direction from theintegral energy conditioner structure. These conductive pathways may bedeposited conductive material, or conductive semiconductor pathways, andmay extend in any direction away from the energy conditioner structure.

Certain embodiments have more than three external conductive bands inwhich each band is not in physical contact with any other band.Preferred embodiments of these novel energy conditioners have theconductive bands configured such that all the conductive bands may beconnected to three planar-shaped conductive areas forming part of themounting structure. These planar conductive terminals may be conductivepads, vias, or pad and via-in-pad combinations. The mounting structuremay be a surface of a first level interconnect, and the pads and vias ofthe mounting structure may be part of the surface of the first levelinterconnect. Alternatively, mounting structure may be a surface of asemiconductor chip, such as an integrated circuit, and the pads and viasmay be part of the surface of the semiconductor chip. A surface can beat any angle, not just horizontal and parallel to the earth or horizon,rather it can be on any surface location operable for attachment.

The term “plate” herein generally is used to simplify explanation bydefining a combination of a dielectric under layer with none, one, ormore than one distinct conductive over layers. However, the relevantstructure is the sequence of conductive layers separated by dielectricmaterial. The hidden surface of the structures referred as plates in thefollowing figures represents a dielectric surface; that is, dielectricmaterial vertically separating the defined conductive layers from oneanother. In discrete energy conditioner component embodiments, thestructure are often formed by layering dielectric precursor material(green material) with conductive layer precursor material (conductivepaste or the like), firing that layered structure at temperaturessufficient to convert the dielectric precursor to a desired structurallyrigid dielectric material and to convert the conductive precursor layerto a high relatively conductivity (low resistivity) conductive layer.However, embodiments formed in interconnects and semiconductorstructures would use different techniques, including conventionallithographic techniques, to fabricate equivalent or correspondingstructures to those shown in the figures. Importantly, the conductivebands and solder connections for stacked layers discussed herein belowwould in many cases be replaced by an array of conductively filled orlined vias selectively connecting conductive layers of the same masterelectrode to one another. Preferably, those vias would be spaced toselectively contact the tab regions of the A, B, and G layers discussedherein.

BRIEF DESCRIPTION OF THE DRAWINGS:

FIG. 1A is a plan view of a novel layer of an A master electrode of anovel energy conditioner;

FIG. 1B is a plan view of a novel layer of a B master electrode of anovel energy conditioner;

FIG. 1C is a plan view of a novel layer of a G master electrode of anovel energy conditioner;

FIG. 1D is a plan view of a layer of dielectric material, D, often usedin the novel energy conditioners disclosed herein;

FIG. 2 is a plan view (plan view meaning a view of the plane defined bythe major surfaces) showing layers 1 and 20 (layer 1 is at least aportion of A master electrode and layer 20 is at least a portion of Bmaster electrode) in an overlapped relationship in which they typicallyexist in novel energy conditioners disclosed herein;

FIG. 3A is a plan view showing an arrangement 300 of shapeableconductive material for both tying together tabs of A and B masterelectrodes of the novel energy conditioners disclosed herein andconductively connecting A, B and G master electrodes to conductiveelements of surface mounting structure by solder, conductive material,re-flow solder material, conductive adhesive;

FIG. 3B is a plan view showing an arrangement of a set of conductiveelements for tying together tabs of A and B master electrodes andconductively connecting to one another tabs of G master electrodes ofthe novel energy conditioners disclosed herein;

FIG. 3C is a plan view of the set of conductive elements of FIG. 3B andalso shapeable conductive material for connecting the members of thatset of conductive elements to conductive elements of the mountingstructure;

FIG. 3D is a plan view of an alternative set of conductive elements tothe conductive elements shown in FIG. 3C and shapeable conductivematerial for connecting that alternative set of conductive elements toconductive elements of the mounting structure;

FIG. 4A-F and 4H-L are each a perspective view showing outer surface ofnovel energy conditioners having different configurations of externalconductive bands;

FIG. 5A is a schematic view of a sequence of stacked conductive layersof novel energy conditioners disclosed herein, in which the stack isexploded along a vertical axis and each layer is then rotated 90 degreesabout its horizontal axis, in order to show the shape of the majorsurface of each layer and the stacking alignment of the layers;

FIG. 5B is the same type of schematic view as FIG. 5A, showing the samethree conductive layers, and also shows an additional dielectric layeron the top of the stack;

FIG. 5C is the same type of schematic view as FIG. 5A, showing a set offour conductive layers of novel energy conditioners disclosed herein;

FIG. 5D is the same type of schematic view as FIG. 5A, showing a set offive conductive layers of novel energy conditioners disclosed herein;

FIG. 5E is the same type of schematic view as FIG. 5A, showing a set ofseven conductive layers of novel energy conditioners disclosed herein;

FIG. 5E is the same type of schematic view as FIG. 5A, showing a set ofnine conductive layers of novel energy conditioners disclosed herein;

FIG. 6 is a plan view of certain conductive elements and a bottomdielectric layer of an embodiment of a novel energy conditioner 600;

FIG. 7. is a plan view of certain conductive elements and a bottomdielectric layer of an embodiment of a novel energy conditioner 700 thathas a reverse aspect compared to the FIG. 6 embodiments;

FIG. 8A-L are plan views each showing arrangements of conductiveelements of a mounting structure, including conductive pad and/or viastructure to which novel discrete component energy conditionersdisclosed herein may be mounted;

FIG. 9 is a schematic view showing a novel combination of a novel energyconditioner on an arrangement of mounting structure elements includingconductive pads and vias, with one via per pad;

FIG. 10 is a schematic view showing a novel combination of a novelenergy conditioner on an arrangement of mounting structure elementsincluding conductive pads and vias, with two vias per pad;

FIG. 11 is a schematic view showing a novel combination of a novelenergy conditioner on an arrangement of mounting structure elementsincluding conductive pads and vias, with two vias per pad and a centralpad that extends further than the outer two pads such that the centralpad can contact conductive terminals on left and right hand side of theenergy conditioner;

FIG. 12 is a schematic assembly view of a novel energy conditioner andan arrangement of mounting structure elements corresponding to FIG. 3A,illustrating use of shapeable conductive material, such as solder, tocontact both (1) tabs and (2) mounting structure elements, such as padsand conductively filled or lined vias;

FIG. 13 is a schematic assembly view of a novel energy conditioner andan arrangement of mounting structure elements corresponding to FIGS. 3Band 3C, illustrating use of shapeable conductive material, such assolder, to conductively connect (1) the conductive elements for tyingtogether tabs of A and B master electrodes and conductively connectingtabs of G master electrodes to one another to (2) the conductiveelements of a mounting structure, such as pads and conductively filledor lined vias;

FIG. 14 shows one circuit diagram schematically illustrating electricalconnection of energy conditioner 600 or 700. 304B and 302B may connectin parallel with a line running from a source of power to a load, and301B′ and 303B′ may connect in parallel with a line connecting to acircuit or system ground;

FIG. 27 is an exploded view of a set of two plates of a novel energyconditioner in which the plates have been displaced vertically in thepage;

FIG. 28 is a perspective view of an exterior surface of a novel energyconditioner including the stack of two plates shown in FIG. 27;

FIG. 31 is an exploded view of a set of two plates of a novel energyconditioner in which the plates have been displaced vertically in thepage;

FIG. 32 is a perspective view of an exterior surface of a novel energyconditioner including the stack of two plates shown in FIG. 31;

FIG. 33 is a partial schematic of circuit two for use with an energyconditioner having A, B, and G master electrodes; and

FIG. 34 is a partial schematic of a circuit six for use with an energyconditioner having A, B, and G master electrodes.

DETAILED DESCRIPTION:

The same reference numerals are used to refer to identical or similarelements throughout the drawings.

FIGS. 1A to 1C show conductive layers or main body electrodes 1, 20, 40that are stacked above one another in the sequence 1, 40, 20 in novelenergy conditioner devices disclosed herein. Additional conductive mainbody electrodes may be present in the stack. In some cases, alternateconfigurations of stacked electrodes may comprise patterns of A and/or Blayers following stacking sequences where multiple A and B layers can bestacked above or below one another in a random or patterned sequence toone another with or without an interposing shielding layer placedin-between an A layer and A layer, or an A layer and a B layer, or a Blayer and a B layer. Any dielectric material may be used, such as formedinto a dielectric layer 60 of FIG. 1D, to separate the main bodies ofthe main body electrodes from one another.

FIG. 1A shows a novel layer 1 of master electrode A of a novel energyconditioner. Layer 1 includes first tab 2 protruding up from left handside body portion 9 and delimited by first tab side surfaces 3, 4, andfirst tab outer surface 2 a. First tab 2's side surface 4 and layer 1'sside surface 6 optionally define surface region 5 interfacing betweentab elements 4 and 6. Optionally, and as shown, surface region 5 isconcave. Surface regions also together, define a perimeter of anelectrode layer.

Layer 1 also includes second tab 11 protruding from right hand side bodyportion 10 and delimited by second tab side surfaces 12, 13, and secondtab outer surface 11 a. Second tab 11's side surface (unnumbered) andlayer 1 side surface 8 may define an intervening surface region, whichmay be concave.

Tabs 2, 11 are preferably the same size and shape. However, tab 2 may belonger, such as twice as long as tab 11. Preferably, tabs 2 and 11 eachextend less than one half the length (in the direction parallel to sidesurface 7) of layer 1. In a left to right or right to left view, thewidth of tabs 2 and 11 may extend less than one third, less than onefourth, or less than one tenth the length (right to left or left toright) of layer 1.

Second tab 11 projects out from layer 1 lower surface by a tab widthequal to the extent of tab side surface 12. Preferably, tabs 2 and 11have the same tab portion width in terms of projection beyond amain-body side surface or perimeter. However, either tab may be wider(right to left or left to right) than the other.

Tab inner side surfaces 3, 12 are preferably the same length (right toleft or left to right). However, tab inner side surfaces 3, 12 may bedifferent lengths and/or widths. Similarly, tab outer surfaces 2 a, 11 amay be of the same or different lengths, ranging from a fraction of thewidth of layer 1 (that is, the distance between side surfaces 6, 8) upto half the width of layer 1. The corners of layer 1 are shown to berounded. However, they need not be rounded. Layer 1 side surfaces 8, 7,6, 2A, 11A are shown as linear. However, they could be arced or haveother minor variations from linear.

Layer 1 is, by definition, generally planar. However, a main bodyelectrode is an alternative to layer 1. A main body electrode need notbe planar. For example, a main body electrode could have contouredsurfaces, such as arc, partial cylinders, or the like. In addition, amain body surface might have a thickness that varies from point to pointalong its major surface. Layer 1 comprises conductive material,preferably metal, such as copper, nickel, or other relatively lowresistance metals. In other cases, material may be combined withconductive material to add resistance to the electrode.

FIG. 1B shows a novel layer 20 of master electrode B of a novel energyconditioner. Layer 20 is similar in shape to layer 1. In contrast tolayer 1, layer 20 has first tab 21 above body portion 23, in otherwords, above the opposite side of the body of the layer as first tabportion 2 in layer 1. Similarly, layer 20 has second tab 22 below leftside body portion 24, again, on the opposite side as the correspondingsecond tab 11 of layer 1.

First tab 21 is delimited by outer first tab surface 24A, and second tab22 is delimited by outer second tab surface 29. Layer 20 is delimited bylayer 20 side surfaces 25, 26, upper side surface 27, lower side surface28, as well as tab side surfaces 24A, 29. Preferably, second tabs 22 and11 have the same size and shape, and first tabs 2 and 21 have the samesize and shape. Preferably, layers 1 and 20 are mirror images of oneanother about a vertical axis running down the center of each layer.

In the preferred embodiments of energy conditioners contemplated herein,layers 1, 20 may range in thickness from a several tens of angstroms incertain integrated semiconductor embodiments to hundreds of microns indiscrete device component embodiments. Electrode layers may be all ofthe same general thickness as manufacturing process allow, or the may beof a varying thickness, either pre-defined and in a positioned desiredor randomly. Preferred embodiments have major surface areas of layers 1,20 from a few microns to several square centimeters. It should be notedthat various layering of electrodes may be enhanced by a process thatallows for increased conductivity versus an similar layer of the sameconductive material that did not receive a conductivity enhancement.FIG. 1C. shows novel conductive layer 40 of a G master electrodeincluding a main body portion 47, left side tab 43, and right side tab44. Left side tab 43 is delimited by side surfaces 45, 46, and endsurface 43 a. Preferably, right side tab 44 is sized and shapedsimilarly to left side tab 43. However, one of tab 43, 44 may longerand/or wider than the other tab. Tabs 43, 44 may be the same width asmain body portion 47. Side surfaces 41, 42, 43A, 44A, 44B, 44C, (all44's not shown), 45, 46 combine to form a perimeter of electrode orconductive layer 40. These similar side-surface elements of conductivelayers 1 and 20 do so as well.

The main body of conductive layer 40 is partially delimited by top andbottom side surfaces 41, 42. Preferably, the distance between left sidetab 43's upper and lower side surfaces 45, 46, is a substantial fractionof the distance between main body side top and bottom surfaces 41, 42,preferably at least fifty percent, more preferably at least 70 percent,most preferably about 100 percent. In some embodiments, the tabs of theG master electrode are wider than the main body, in which case the ratioof distance between left side tab 43's upper and lower side surfaces 45,46 to the distance between main body side top and bottom surfaces 41, 42is greater than one, such as between 1.1 and 1.5, and may exceed 5,referred to herein as flared tabs.

Preferably, conductive layer 40 preferably has a main-body portion thatis larger than the main-body portions of layers 1 and 20 and thusextends beyond the main-body portions perimeters of layers 1 and 20 withthe exceptions of the tabs of layers 1 and 20. Internal electrodes, mainbodies, or layers, such as 1, 20, 40, may comprise any metal materialssuch as (but not limited to) nickel, nickel alloy, copper, or copperalloy, palladium alloys, or any other conductive material and/orcombination of materials, semi-conductive materials, and combinationsthereof.

FIG. 1D shows dielectric layer 60 having dielectric layer upper sidesurface 61, dielectric layer lower side surface 63, dielectric layerleft side surface 62, and dielectric body right side surface 64.Corners, like corner 65, may be rounded. Preferably, dielectric layer 60contains no apertures, forming a continuous sheet. However, alternateembodiments include apertures.

Dielectric layer 60 and all other dielectric layers in the contemplatedembodiments of novel energy conditioners have thicknesses from a fewangstroms to tens of microns, may comprise glass, ceramic,polycrystalline, amorphous, and crystalline forms of matter. Some usefulcommercial dielectrics are named to X7R, X5R, COG, NPO, MOV (metal oxidevaristor). Capacitance between two conductive bodies increases as theinverse of their separation distance. Therefore, it is desirable to haverelatively thin dielectric layers in structures designed to providesignificant capacitance. As of 2003, mass production of 0402 sized 2.2uF Multi-Layer Ceramic Capacitors (MLCC), as well as 0603 sized 10 uFcomponents, both of which are the most widely used MLCC types in theindustry. Higher values of capacitance in these and other standard EIApackages are expected. In discrete component embodiments, conductivelayers, like layers 1, 20, 40, are interleaved with dielectric material,like dielectric layer 60, forming a stack of layers. In theseembodiments, preferably dielectric layer 60 and conductive layers 1, 20,40, have dimensions such that each one of conductive layers 1, 20, 40,can be positioned above dielectric layer 60 such that the perimeter ofthe main bodies of the conductive layers reside within the perimeter ofdielectric layer 60, and tab outer side surfaces of the conductivelayers are aligned with the portions of the perimeter of dielectriclayer 60. In addition, in these embodiments, the main body portions ofthe 1, 20 layers may be substantially of the same size and shape as oneanother. It fully contemplated that main-body portions of layer types,such as 1 and 20, may vary in a size and shape relationship to oneanother or groupings of such.

FIG. 2 shows in plan view a novel arrangement of layers 1 and 20. Thisarrangement is how layers 1 and 20 are arranged relative to one anotherin energy conditioner embodiments disclose herein. FIG. 2 shows bodyportions 9, 10 of layer 1 aligned with body portions 24, 26 of layer 20,and each one of tabs 2, 11, 21, 22 projecting away from the bodyportions, in plan view, at non-overlapped regions. FIG. 2 shows theouter side surfaces of tabs 2, 21 are aligned with one another, and theouter side surfaces of tabs 22, 11 are aligned with one another.

FIG. 2 also defines a gap of separation between adjacent tabs. A firstgap 199A is created between tabs 2 and 21 by the stacking arrangement oflayers 1 and 20, and a second gap 199B created between tabs 22 and 11created by the stacking arrangement of layers 1 and 20. These gaps 199Aand 199B clearly show that in order for adjacent tabs (2 and 21) and (22and 11) to be conductively connected to one another, an additionalconductive material portion such as a terminal electrode like a 302A and302B of FIG. 3B will be needed to span the gaps to create a tyingconfiguration. It should also be noted that when stacked with layershaving main-body portions like layer 40, each main-body portion oflayers 1 and 20 are found to be smaller than a main-body portion oflayer 40 and will appear to be inset with the exception of eachrespective tabs of layers 1 and 20.

FIG. 2 illustrates the preferred arrangement of layers 1, 20, relativeto one another, to illustrate that tabs 2, 21 can be easily conductivelyconnected by additional structure extending there between, and that tabs22, 11 similarly be connected. In the novel energy conditioner devicesdisclosed herein, a conductive layer 40 exists between layers 1, 20. Asassembled or fabricated, preferably the top and bottom surfaces 41, 42,of the main body portion 47 of the master G electrode extend at least asfar as the side surfaces of the main body portions of layers 1, 20. Morepreferably, in an assembly or fabrication, upper surface 40 extendfurther up than main body portions of layers 1, 20, and lower surface 42extends further down than main body portions of layers 1, 20.

As described with respect to FIG. 5, the novel energy conditioners mayhave varying sequences of conductive layers including layers 1, 20, and40. These varying sequence of layers are contemplated as internalstructure for all structures shown in and discussed with respect toFIGS. 3-4 and 6-17. In addition, while it is preferred to have a layer40 in-between a stacking of layer 1 and 20, alternative embodiments arefully contemplated such as were layers 1 and 20 do not have aninterposed layer 40 between layer 1 and 20 somewhere in a stackingsequence. Arrangements of a layer 40 is inserted during a stackingsequence at a predetermined interval relative to the sequence of layers1 and 20 is fully contemplated, as are stacking arrangements of a layer40 is inserted during a stacking sequence at a random interval relativeto the sequence of layers 1 and 20.

Moreover, the specific shapes of the conductive layers 1, 20, and 40 areexemplary, except for the existence of tabs generally overlapped asshown in FIG. 2. Thus, the layers shown in FIGS. 1A-1C may for example,include additional tabs concave side edged, convex side edges, majorsurfaces that are not flat, such as curved or wavy.

In addition, layers shown in FIGS. 1A-1B may be varied to includecavities or insets adjacent the inner sides edges of tabs, for exampleto further define a path of current flow within the corresponding mainbody portions. The cavities may be varying shapes, such as straight,arc, sinuous, or “L” shaped.

FIGS. 3A-3D show various arrangements of conductive materials andportions and conductive plates or layers to conductively directlyconnect all tabs of layers of the A, B and G master electrodes that areon the same side of the energy conditioner as one another, to eachother, and to conductively connect each side of the energy conditionerto a mounting structure. FIGS. 3A-3D do not show a mounting structure.

FIG. 3A shows arrangement 300, which is a set of four conductiveattachment material portions 301A, 302A, 303A, and 304A. This materialmay be a solder, a solder paste, or any conductive adhesive material,re-flow solder material or compounds that attach, for example. Theseconductive elements are usually variable in amount applied and may vary.These materials are usually applied during a mounting process, such aswhen a device is mounted to a conductive structure as part of a systemsuch as a PCB board for example. The conductive attachment materialportions are arranged so that: conductive material region 302Aconductively contacts first tabs 2 and 21 to one another; conductivematerial region 304A conductively contacts second tabs 11 and 22 to oneanother; conductive material region 301A connects conductive tabs 43(when the G master electrode includes more than one layer like layer 40)to one another; and conductive material region 303A connects conductivetabs 44 (when the G master electrode includes more than one layer likelayer 40) to one another. In addition, conductive material regions 301A,302A, 303A, 304A may contact to conductive elements of a mountingstructure, such as the structures shown in FIG. 8A-8L.

FIG. 3B shows a set of four applied conductive elements 301B, 302B,303B, 304B, such as terminals or conductive electrode material that areapplied to a body of the device before any final attachment of a deviceinto a system. Conductive elements 301B, 302B, 303B, 304B, are arrangedso that each one will face and contact to the outer side surfaces of thetabs of layers 1, 20, and 40. If elements 301B, 302B, 303B, 304B areelectrode terminals made of conductive material, they may need to beconductively connected to outer side surfaces of the tabs of layers 1,20, and 40 by intervening shapeable conductive material, such as solder.

FIG. 3C shows conductive elements 301B, 302B, 303B, 304B as in FIG. 3B,and also conductive attachment material portions 311, 312, 313, 314.Conductive attachment material portions may be used to conductivelyconnect conductive elements 301B, 302B, 303B, 304B to elements of amounting structure, such as the structures shown in FIG. 8A-8L.

FIG. 3D is similar to FIG. 3C, showing conductive attachment materialportions 311, 312, 313, 314 and conductive elements 301B and 303B.

FIG. 3D is different from FIG. 3C in that it includes conductiveelements 302B1 and 302B2 in place of 302B. Referring back to FIGS. 1Aand 2, conductive element 302B1 is conductively connected to first tab 2of layer 1. Conductive element 302B2 is conductively connected to firsttab 21 of layer 20. In FIG. 3D, shapeable conductive material 312 servesthe additional function of conductively connecting conductive elements302B1 to 302B2, and likewise conductively connecting conductive elements304B1 to 304B2.

Both the conductive attachment material portions and the conductiveelements 302 may be formed from materials referred to as conductivepaste, conductive glue, conductive solder material. These materials maycomprise any metal material such as (but not limited to) nickel, nickelalloy, copper, or copper alloy, or any other conductive material thatcan facilitate electrical/conductive connection. The manufacturingprocesses for applying and connecting shapeable conductive materialand/or conductive elements to tabs or other conductive elements caninclude applying them to surfaces, hardening them, or providing theirdesirable conductive properties by one or more of spraying, painting,soldering, such as reflux soldering, wave soldering, and hightemperature firing. It should be noted that the conductive elements,such as 301B to 304B, may be formed from the same or similar materialshapeable conductive materials, such as elements 301A to 304A, referredto in FIGS. 3A-3D. A difference being that material referred to asconductive attachment material portions have an additional function ofconductively connecting to a conductive structure or conductive surfaceon which a novel energy conditioner resides.

FIGS. 4A-F and 4H-L show outer surfaces of novel energy conditionershaving different configurations of external conductive bands orterminals. These outer conductive bands generally correspond in functionto the elements 301B, 302B, 303B, and 304B of FIG. 3B or elements 301B,302B1, 302B2, 303B, 304B1, and 304B2 in FIG. 3D. That is, the outerconductive bands are the elements that provide conductive connection oftabs on the same side as one another (FIG. 3B) or conductive connectionat least of vertically aligned tabs (FIG. 3D).

Moreover, each one of the band structures shown in FIGS. 4A-F and 4H-Lare compatible with and can connect to the various arrangements andcombinations of elements of surface mounting structure shown in FIGS.8A-8L, as described below.

FIG. 4A shows energy conditioner 400 having external conductive bands401A, 402A, 403A, 404A. Band 401 is shaped like a cap, extending on 5adjacent sides (2 sides shown, 3 sides hidden); band 404 is shaped likea “U” extending along conditioner side surface 405A to conditioner topsurface 406A and to conditioner bottom surface (hidden). Each band isphysically separated from one another by dielectric 407A.

In one embodiment including the FIG. 4A bands, internal to conditioner400, first tabs 2, 21 (of A and B master electrodes), may connect toband 401A, second tabs 22, 11 (of A and B master electrodes) may connectto band 402A, and tabs 43, 44 (of G master electrode) may connectrespectively to bands 403A, 404A.

In a second embodiment including the FIG. 4A bands, internal toconditioner 400, first tabs 2, 21, (of A and B master electrodes), mayconnect to band 403A, second tabs 22, 11 (of A and B master electrodes)may connect to band 404A, and tabs 43, 44 (of G master electrode) mayconnect respectively to bands 401A, 402A, respectively. Note that, inthis embodiment, tabs of the A and B master electrodes may be displacedslightly from the left and right hand sides by regions like region 5 inFIG. 1A, so that the A and B electrodes do not conductively contact thebands 401A, 402A. In addition, in this embodiment, the bands 403A, 404A,may be extend further than shown between side surfaces 408A, 409A sothat they contact a large fraction of the length of outer or sidesurfaces of tabs of layers 1, 20, such as outer side surface 2 a.

FIGS. 4B and 4C show conductive band arrangements similar to FIG. 4A inwhich similar internal connection to tabs of the A, B, and G layers aremade. FIGS. 4B and 4C have a central band 410B, 410C, extending on thetop or on the top and bottom surfaces of the energy conditioner,conductively connecting bands 404B, and 404C to one another with one ortwo paths that are external to the G master electrode's structure.

In one alternative in which central band 410B conductively connects tothe G master electrode, and central band 410B forms a ring around theenergy conditioner, top and bottom layers, like layers 40, of the Gmaster electrode are not included in the layered structure, since theirfunction is provided by the top and bottom portions of the ring 410B.

In one alternative, A and B tabs connect to 410B. In this case, anenhancement of (lowering of) the impedance profile because of a largerconductive area will be observed. FIG. 4E shows band 402 split intobands 402E1 and 402E2, corresponding generally to the split conductiveelements 302B1 and 302B2 of FIG. 3D. In one embodiment, bands 402E1,402E2 internally conductively contact to first tabs 2, 21, respectively.In another embodiment, bands 402E1, 402E2 both internally conductivelycontact to different portions of tab 44 of the master G electrode ofFIG. 1C.

FIG. 4H shows a structure with a reverse aspect, in so far as the bandsare concerned, compared to FIG. 4A. That is, the bands having the cappedshape reside on the relatively longer sides in FIG. 4H and on therelatively shorter sides in FIG. 4A. These relatively wider cappedshaped bands enable a relatively low ESR. Certain applications mayrequire a specified ESR along certain lines. The FIG. 4A and 4H reversedaspects and their different ESR values provide one design mechanism tocontrol ESR to desired values. Lower ESR when combined with a mountingstructure can produce an ultra-low ESL measurement for the combinationof the inner electrodes with respective tabs, terminal electrodes,conductive attachment material, mounting structure and arranged vias ascompared to other devices.

FIG. 4J corresponds closely to the contact arrangement shown in FIG. 3Dwherein bands 404J1 and 404J2 correspond to conductive elements 304B1,304B2. In one embodiment of FIG. 4J, first tabs 2, 21, each internallyconnect respectively to bands 404J1, 404J2. In another embodiment, firsttabs 2, 21 both internally connect to along end 409J to band 402J.

FIG. 4L show three side bands, bands 404L1, 404L2, and 404L3. It alsoshows side band 402L. Various embodiments having this band arrangementhave: band 404L2 connected to tab 44 the G master electrode, band 404L3and 404L2 connected to second tab 11 of the A master electrode, and band404L2 and 404L1 connected to second tab 22 of the B master electrode.That is, tabs of A and B main body electrodes each connect to more thanone tab and both connect to the central tab 404L2.

In one FIG. 4L alternative, second tab 11 may connect to two of thethree bands 404L1, 404L2 and/or 404L3 and second tab 22 connect only tothe remaining band. In embodiments in which one tab connects to morethan one band, the outer side surface of the tab at locations where thetab does not oppose or connect to a band may be recessed from the sidesurface of the energy conditioner. The outer side surface of the tab inthe recessed regions may be covered by dielectric material therebypreventing this region of the tab from being exposed on a side of theenergy conditioner.

In another FIG. 4L alternative, second tabs 11, 22 may both only connectto the central band 404L2, and all other bands may connect only to thetabs of layers 40 of the G master electrode. In this embodiment, thetabs of the G master electrode are extended to extend from end portionsof top and bottom surfaces 41, 42 of layer 40 so that the extendedportions of the tabs may internally contact bands 404L1, 404L3. In thisembodiment, layer 40's tabs also internally connect to the conductiveband on end 402L.

The foregoing exemplary descriptions of embodiments for some of FIG.4A-F and 4H-L shows that second tabs 11, 22, for example, can beadjacent any one of the four side surfaces of any one of the FIG. 4A-Fand 4H-L band structures, and all alternative connections of second tabs11, 22 to bands along the adjacent side are contemplated. The size andshape of tabs may vary to provide a longer and more aligned interfacebetween the outer side surface of the corresponding tab and the opposinginner side of the corresponding conductive band or bands.

Each of these outer band structures constitute part of at least one ofthe master electrodes. Each band may connect to one of the A, B, and Gmaster electrode, or to both the A and B master electrodes.

Preferably, there is at least two bands for each pair of masterelectrodes, such as the A and B master electrode pair.

The energy conditioners shown in FIG. 4A-F and 4H-L may have thesubstantially the same length in two dimensions or three dimension, suchthat they have a length to width ratio of substantially 1 and a heightto width ratio of substantially 1.

Preferably, preferably no more than two of the six surfaces of theenergy conditioners shown in FIG. 4A-F and 4H-L have the same area. Insome embodiments, however, 4 of the six surfaces do have the same area,such is FIG. 4D.

The bands forming a cap as shown by element 401A in FIG. 4A may bereplaced by bands covering only 4,3, or two of the surfaces covered byband 401A. Similarly, bands shown covering only one surface may beextended around adjacent surfaces, partially as shown by band 404A inFIG. 4A, or completely as shown by band 410B in FIG. 4B. The straightedges of the bands may be replaced by curves, of various shapes, thecorners and edges of the bands may be rounded, or flared, includecavities or protrusions. In addition, conductively floating bands, bandsnot connected to a master electrode, may be disposed on dielectricsurfaces of the energy conditioners as additional shielding.

FIGS. 5A-5F shows some of the contemplated conductive layer stackingsequences of the novel energy conditioners. Layers or main bodies of theA, B, and G master electrodes are referred to with respect to FIGS.5A-5F below for convenience as merely A, B, or G respectively. FIG. 5Acorresponds to the layers 1, 20, and 40 of the A, B, and G masterelectrodes shown in FIGS. 1A-1C in the sequence A, G, B.

FIG. 5B shows the sequence from top to bottom dielectric layer, A, G, B.FIG. 5B illustrates that the top (and bottom) conductive layers arepreferably covered by dielectric.

FIG. 5C shows the sequence from top to bottom: A, G, B, G.

FIG. 5D shows the sequence from top to bottom: G, A, G, B, G.

FIG. 5E shows the sequence from top to bottom: G, G, A, G, B, G, G.

FIG. 5F shows the sequence from top to bottom: A, G, G, A, G, A, G, B,G.

All of the sequences of layers include a G layer, one A layer above theG layer, and one B layer below the G layer.

None of the sequences include an A, B with no intervening G therebetween. However as stated earlier there are situations where such astacking is fully contemplated. For example, another stacking might havea sequence from top to bottom may have amongst its stacking: A, G, B, G,A, B, A, G, B, G, A, B and so on.

FIG. 6 shows novel energy conditioner 600 having sides 610, 620, 630,640. FIG. 6 shows a sequence of stacked layers from top to bottom of 1,40, 20, 60 (A, G, B, dielectric). Dielectric layers above dielectriclayer 60 are not shown for convenience in order to show and describerelevant structural features of the conductive layers and elements.

FIG. 6 shows conductive elements 304B, 302B, tying the first tabstogether, and tying the second tabs together. FIG. 6 show first tabs 2,21 of the master A and B electrodes both contacting conductive element304B, second tabs 11, 22, second tabs 11, 22 contacting conductiveelement 302B. FIG. 6 shows conductive elements 301B′, 303B′ contactingrespectively to tabs 44, 43 of the G master electrode.

FIG. 6 shows generally annular region 48 of G master electrode's layer40 extending on all sides beyond the edges of the main body portions ofthe layers 1, 20 of the A and B master electrodes. FIG. 6 shows annularregion 48 of the G master electrode contained within the footprint ofdielectric layer 60 such that the only regions of the G master electrodeadjacent side surfaces of dielectric layers are the outer edge sidesurfaces of the G master electrode tabs 43, 44.

FIG. 6. also shows a gap 601A between the edges of tabs 11 and 22 and acorresponding gap 601B between edges of tabs 2, 21. The existence of gap601A, 601B results in all paths in layer 1 between the tabs of layer 1crossing all paths in layer 20 between the tabs of layer 20. Conductiveelement 301B′ includes side portion 602 602′ on side 610, and conductiveelement 301B′ may include corresponding top and bottom portions (notshown) on top and bottom surfaces of energy conditioner 600. Sideportion 602′ of conductive element 301B′ does not extend along the sidefar enough to contact second tab 11. However, corresponding top andbottom portions of conductive element 301B′ can extend further along thetop and the bottom of energy conditioner 600, since no portion ofconductive layers 1, 20 of the A or B master electrodes resides on thetop and bottom of energy conditioner 600.

Energy conditioner 600 has side surfaces 610, 620, towards which tabs 2,21, 11, 22 of the A and B master electrodes project, longer than sidesurfaces 630, 640 towards which tabs 43, 44 of the G master electrodeproject.

The ratio of a length of a side of an energy conditioner having tabs forthe A and B master electrodes to a length of a side of energyconditioner 600 having tabs for the G master electrode is defined hereinas an energy conditioner aspect ratio. The energy conditioner aspectratio of energy conditioner 600 is greater than one.

In energy conditioner 600, sides 610, 620 to which tabs of the A and Bmaster electrodes attach are longer than side 630, 640 to which tabs ofthe G master electrodes attach. In alternatives to the FIG. 6embodiment, gaps 601A, 601B do not exist, such as when there is partialoverlap of A, B electrodes. However, this type of configuration isbelieved to be less effective (but still effective) in conditioningenergy than when there is no partial overlap. In alternatives to theFIG. 6 embodiment, gap 601A may exist, but gap 601B may not exist due todifferent sized and shaped tabs on opposite sides of the A and B masterelectrodes. This alternative also specifically applies to embodimentswith more than A and B master electrodes, such as embodiment with morethan 4 sides.

FIG. 7 shows energy conditioner 700, which has a reversed aspect ratiocompared to the aspect ratio of energy conditioner 600. The aspect ratioof energy conditioner 700 is less than one. In FIG. 7, sides 630, 640 towhich tabs of the A and B master electrodes attach are shorter thansides 610, 620 to which tabs of the G master electrode attach. Energyconditioner 700 defines gap 601A between the edges of tabs 11, 22, andgap 601B between the edges of tabs 21, 2.

Layer 40 extends beyond the perimeter of layers 1, 20 a distance 710.Tab 43 of layer 40 extends beyond the perimeter of layers 1, 20 adistance 720, which includes the distance 710 and the extension lengthof tab 43 toward side surface 620. Preferably, distance 710 is greaterthan zero, more preferably at least 1, 2, 5, 10, or 20 times thedistance separating layer 40 from the closest main body or layer of theA or B master electrodes.

Conductive layers 1, 20 of FIG. 7 are shaped differently from conductivelayers 1, 20 of FIG. 1 in that the tab portions reside on the shortersides of these layers.

FIG. 8A-L each show one arrangement of conductive elements of mountingstructure for mounting a single one of the novel discrete energyconditioners. These arrangements are also referred to as land patterns.The mounting structure may be a surface of a PC board, the surface of afirst level interconnect, or the surface of a semiconductor chip,including for example an ASIC, FPGA, CPU, memory chip, transceiver chip,computer on a chip, or the like. The mounting structure comprisesportions of the mounting surface to which a discrete component may bemechanically mounted and electrically connected. The mounting structureincludes conductive pad and/or via structure. The via structure may befilled or lined with conductive material. The via structure may includea dielectric block preventing DC current transmission. Many of themounting structures to which novel energy conditioners relate includevias extending perpendicular to layering, and conductive pathwaysdefined in the plane of the layers. In PC board and some first levelinterconnects, the vias connect to conductive lines that extend to someother mounting structure on the boards or interconnects or to embeddedpassive circuitry such as embedded capacitors, inductors, resistors, andantennas. In semiconductor chips, the conductive lines in at least someinstances extend to an active circuit component formed in the chip, suchas a diode, transistor, memory cell, or the like.

FIG. 8A shows an arrangement 800A of mounting structure including a setof three generally rectangular shaped conductive pads 801, 802, 803.Conductive pads 801, 802, 803, have relatively long sides (unnumbered)and relatively short sides. The relatively short sides are labeled 801A,802A, and 803A. Relatively short sides 801A, 802A, 803A are aligned withone another such that a straight line segment could contactsubstantially all of short sides 801A, 802A, and 803A. Conductive pad801 contains vias 801V1, 801V2. Conductive pad 802 contains vias 802V1,802V2. Conductive pad 803 contains vias 803V1, 803V2. Vias 801V1, 802V1,and 803V1 are aligned such that a single line segment could intersectthem. Vias 801V2, 802V2, and 803V2 are aligned such that a single linesegment could intersect them. It should be noted that, while manydrawings shown such as FIGS. 9, 10, 11, 12, 13 depict placement of adevice over a via or vias, the drawings are representative of thenumbers of vias and pads with a device rather than true location ofvia(s) relative to a device structure.

Arrangements depicted disclose vias that tap various conductive layerslocated beyond the device attachment to a mounted conductive structure,such as power in (from an energy source) and/or power return (such as anenergy return back to a source and/or a ground).

In an alternative to arrangement 800A, pads may have different sizes,lengths, or widths from one another. For example, pad 802 may be shorterthan pads 801, 803.

In another alternative to arrangement 800A, outer pads 801, 803 may havea different shape than central pad 802. For example, outer pads 801, 803may include convex central regions and/or flared end regions. Forexample, outer pads 801, 803 may be the same length as one another butshorter or longer than central pad 802.

In another alternative to arrangement 800A, certain vias may have adiameter larger than the width or length of the pad to which they areattached such that the via is not entirely contained within thefootprint of a conductive pad. For example, a via diameter may be equalto a width of a conductive pad, 1.5, 2, or 3 times larger or smallerthan a width of the conductive pad.

In another alternative to arrangement 800A, certain vias may havedifferent cross-sectional diameters from one. For example, cross-sectiondiameters of vias connecting to the central pad 802 may be ⅓, 2, 1, 1.5,2, or 3 times larger or smaller than the cross-sectional diameter ofvias connecting to outer pads 801, 803.

In another alternative to arrangement 800A, vias 802V1, 802V2 may bespaced from one another by more than or less than the spacing betweenvias 801V1, 801V2 and the spacing between 803V1, 803V2.

In another alternative to arrangement 800A, each conductive pad maycontain one, two, three, or more vias. For example, each conductive pad801, 802, 803 may contain a single via. For example, pads 801 and 803may contain 2 or 3 vias and pad 802 may contain one via. For example,pads 801 and 802 may contain 1 via and pad 802 may contain 2 or 3 vias.

In another alternative to arrangement 800A, the pads may not exist inwhich case just conductive vias exist in one of the foregoingarrangements. For example, two parallel rows of three vias.

In another alternative to arrangement 800A, some pads may have connectedvias and some may not. For example, central pad 802 may contain 1, 2, 3,or more vias and outer pads 801, 803 may contain no vias. For example,central pad 802 may contain no vias and each outer pad 801, 803, maycontain 1, 2, 3, or more vias.

In another alternative to arrangement 800A, the cross-sections of viasmay not be circular, such as elliptical, elongated, or irregular.

FIGS. 8B-8L show various arrangements of the alternatives discussedabove.

FIG. 8B shows arrangement 800B of mounting structure having vias of pad802 more widely spaces than vias of pads 801, 803.

FIG. 8C shows arrangement 800C of mounting structure having vias havingelongated cross-sections.

FIG. 8D shows arrangement 800D of mounting structure having a single viain each one of pads 801, 802, 803.

FIG. 8E shows arrangement 800E of mounting structure having pads 801 and803 each having one centrally located via.

FIG. 8F shows arrangement 800F of mounting structure having pads 801,802,803 having no vias.

FIG. 8G shows arrangement 800G of mounting structure having pads 801,802, 803 each having three vias, each via in each pad aligned with onevia in each one of the other two pads. FIG. 8H shows arrangement 800H ofmounting structure having single via pads in which the central pad 802is short than the outer pads 801, 803.

FIG. 81 shows arrangement 8001 of mounting structure having outer pads801, 803 longer than central pad 802, the outer pads each having twovias and central pad 802 having one via. FIG. 8J shows arrangement 800Jof mounting structure having three pairs of vias, and no pads.

FIG. 8K shows arrangement 800K of mounting structure having outer pads801, 803 having two vias and central pad 802 having three vias.

FIG. 8L shows arrangement 800L of mounting structure having central pad802 having one via and outer pads 801, 803 having no vias.

Preferably, vias in each pad are spaced symmetrically on either side ofthe center of the pad. Preferably, the arrangement of vias is symmetricabout the center point of central pad 802. The only constraint onvariations of pads and vias combinations, sizes, and shapes in that theresulting arrangement must be configured to provide electrical orconductive contact to the A, B, and G electrodes of a discrete componentnovel energy conditioner. Thus, all of the various features of thealternative arrangements described above are compatible with oneanother, and the inventors contemplate all possible mix and matchcombinations.

Preferably, the combination of novel energy conditioner and surfacemounting structure provides (1) a first in electrical or conductivecontact to at least one and more preferably all conductive bandsconnected to one side of the A and B master electrodes, (2) a second inelectrical or conductive contact to at least one and preferably allconductive bands connected to the opposite side of the A and B masterelectrodes, and (3) a third element in electrical or conductive contactto at least one and preferably all bands connected to both of theopposite ends of the G master electrode. The foregoing reference toelectrical contact includes situations where DC current is blocked, suchas where a dielectric cap or layer exists somewhere along a via. FIGS.9-13 each schematically show a combination of a novel energy conditionerin operable location on arrangement of conductive mounting structureelements.

FIG. 9 shows a novel arrangement of an energy conditioner and mountingstructure. FIG. 9 shows a novel energy conditioner 700′, similar toenergy conditioner 700 of FIG. 7, on mounting structure arrangement800D. Energy conditioner 700′ differs from energy conditioner 700 inthat energy conditioner 700′ lacks conductive elements 302B, 304B.

FIG. 9 shows conductive element 303B′ (the conductive structure whichties together first tabs of the A and B master electrodes) aboveconductive pad 801, conductive element 301B′ (the conductive structurewhich ties together second tabs of A and B master electrodes) aboveconductive pad 803. Conductive element 303B′ can be conductivelyconnected to pad 801, and conductive element 301B′ can be conductivelyconnected to pad 803, via use of shapeable conductive material, physicalcontact, or welding.

FIG. 9 also shows both conductive elements 302B, 304B (the conductiveelements that connect to tabs of the G master electrode) above regionsof conductive pad 802. In this spatial relationship, shapeableconductive material can be applied to connect to tabs 43, 44 of the Gmaster electrode to conductive pad 802.

In Fig, 9, three conductive pads, pads 801, 802, 803, connect to allexternal electrode contacts, of energy conditioner 700′. Pad 802connects to both tabs 43, 44, on opposite sides of the G masterelectrode.

FIG. 9 shows central conductive pad 802 wider and having larger surfacearea than either outer conductive pad 801, 803.

FIG. 10 shows a novel energy conditioner, such as energy conditioner 700of FIG. 7, above mounting structure arrangement 800A of FIG. 8A.Conductive elements or bands 303B′, 301B′ reside respectively aboveouter pads 801, 803. Conductive elements 302B, 304B (which connectrespectively to tabs 43, 44, on opposite sides of the G masterelectrode) reside above inner pad 802. Conductive structure residingabove each such pad can be conductively connected to that pad.

FIG. 11 shows a novel energy conditioner, such as energy conditioner600, arranged above mounting structure arrangement 800A′. Mountingstructure arrangement 800A′ is a modified version of arrangement 800A ofFIG. 8A, in which central pad 802 is extended. However, mountingstructure arrangement 800A′ has central pad 802 extending horizontallybeyond the horizontal extent of outer pads 801, 803, and extendinghorizontally far enough to underlay conductive elements 301B′, 303B′ atsides 630, 640. In addition, neither outer pad 801, 803 extends farunderlay and contact conductive elements 301W, 303B′ at sides 630, 640.

FIG. 12 is a schematic assembly of the arrangement of shapeableconductive material arrangement 300 of FIG. 3A, energy conditioner 600′,and mounting structure arrangement 800A of FIG. 8A. Energy conditioner600′ is similar to energy conditioner 600 of FIG. 6. However, energyconditioner 600′ does not have conductive elements 302B, 304B tying tabstogether. Instead, energy conditioner 600′ has split conductive elements302B1 and 302B2, each of which connects to one set of stacked tabs ofthe A or B master electrode.

FIG. 12 schematically shows shapeable conductive material 302A tyingtabs contacting split conductive elements 302B1 and 302B2 together, andalso conductively contacting pad 302. FIG. 12 also shows shapeableconductive material 304A tying tabs contacting split conductive elements304B1 and 304B2 together, and also conductively contacting pad 302.

FIG. 13 is a schematic assembly of the arrangement of shapeableconductive material arrangement 300 of FIG. 3A, energy conditioner 600of FIG. 6, and mounting structure arrangement 800A of FIG. 8A. In FIG.13, shapeable conductive does not tie any electrode tabs. Instead,shapeable conductive material only conductively connects conductiveelements, such as bands, to conductive pads 301, 302, 303.

FIG. 14 shows one circuit diagram schematically illustrating electricalconnection of energy conditioner 600 or 700. 304 and 302B may connect inparallel with a line running from a source of power to a load, and 301B′and 303B′ may connect in parallel with a line connecting to a circuit orsystem ground.

FIGS. 27, 28, 31, and 32 are views of energy conditioners includingconductive layers on three planes and various external structures.

FIG. 27 shows stack 27A including plates 2500A and 2700B. Plate 2700Bdiffers from plate 2500B in that the tabs G1T1 and G1T2 of layer G1 arein the LS and RS as opposed to the US and LLS.

FIG. 28 schematically shows an energy conditioner defined by onearrangement of (1) stack 27A and (2) external structure 3A of FIG. 3A.Tabs A1T1 and B1T1 contact the internal surface of conductive band C3,tabs A1T2 and B1T2 contact the internal surface of conductive band C1,tab G1T1 contacts the internal surface of conductive band C2, and tabG1T2 contacts the internal surface of conductive band C4. In this energyconditioner, the A and B master electrodes are conductively tiedtogether at the edges of the tabs by conductive bands C1, C3.

FIG. 31 shows stack 31A including plates 2500A and 2500B. Stack 31A alsoincludes a second plate 2500C having the same layered pattern as plate2500A and on an opposite side of plate 2500A relative to plate 2500B.Plate 2500C has conductive layers A2 and B2 having tabs aligned withcorresponding tabs of plate 2500A, including tab A2T1, A2T2, B2T1, andB2T2.

FIG. 32 schematically shows an energy conditioner defined by onearrangement of (1) stack 31A and (2) external structure 3A of FIG. 3A.In this structure, tabs for conductive layers of the same masterelectrode are aligned in the stack and contact conductive bandstructure. For example, tabs A1T1 and A2T1 are aligned and contact theinternal surface of conductive band C1.

Alternatively, for FIG. 31, plate 2500C may be replaced by a platehaving a conductive pattern that is a mirror image of the conductivepattern on plate 2500A, the mirror defined by a vertical line passingthrough the center of conductive plate 2500A. In this alternative,conductive tabs A1T1 and B2T2, for example, are vertically aligned andconductively connected by contacts to the inner surface of conductiveband C1.

FIGS. 33 and 34 show circuits including an energy conditioner having A,B, and G master electrodes, which relate to the special properties ofsuch conditioners. The inventors have determined that connection of theG master electrode at least two points, preferably at two points onopposite sides from one another, provides significant advantages. Thisis in spite of the fact that the G master electrode is a singleconductive structure wherein location of connection would not berelevant in a lumped circuit representation. Circuit diagrams rely upona lumped circuit model for accuracy of representation. In order torepresent this geometric requirement relating to distributed circuitdesign in lumped circuit figures, the inventors schematically representthe energy conditioners as devices having at least 3 terminal device,with A, B, G terminals. More terminals may exist for each masterelectrode, and additional master electrodes may be integrated into thesame component. The inventors have also determined that relativelocations of A, B, and G electrode terminals relative to the A, B, and Gmaster electrode structures, may affect performance of the energyconditioners. FIG. 33-34 therefore show circuits peculiar to this typeof energy conditioner.

In FIGS. 33-34, external terminal A conductively connects to the Amaster electrode, external terminal B conductively connects to the Bmaster electrode, external terminal G1 conductively connects to the Gmaster electrode. More specifically as used in FIGS. 7-12, embodimentshaving at least 2 G external terminals, such as a G1 and G2, a firstside of the G master electrode, and external terminal G2 conductivelyconnects to a different side of the G master electrode.

FIGS. 33-34 each show conditioner 700, and external terminals A, B, G1,and G2. The G master electrodes is represented by portions 702, 705, andthe A and B master electrodes are represented respective by flat plateelements 703, 703. Internal to conditioner 700, the G master electrodeis spaced between or acts to shield the effects of charge buildup on theA master electrode from the B master electrode. This is schematicallyrepresented by the portion 702 of the G master electrode extendingbetween the flat plate elements 703, 704 of the A and B masterelectrodes. G master electrode portion 705 schematically representsshielding by the G master electrode of the A and B master electrodesrelative to space outside conditioner 700.

FIG. 33 shows a circuit 2 configuration for a conditioner 700 having A,B, and G master electrodes. External terminal A is tied to node AS onpath S, external terminal B is tied to node BS also on path S, externalterminal G1 is tied to node G1R on path R, and external terminal G2 istied to node G2R also on path P. Arrows above and below conductive pathsbetween SOURCE S of electrical power and LOAD L indicate that currentflows in a loop.

FIG. 34 shows a circuit 6 configuration wherein external terminal A istied to a node on path R, external terminal B is tied to a node on pathR, and external terminals G1 and G2 are tied to nodes on path S.

The foregoing embodiments provide only exemplary descriptions of thenovel energy conditioners and assemblies. Obvious modifications andalternatives are within the scope contemplated by the inventors. Thefollowing claims define the novel concepts discussed above.

1. An energy conditioner comprising: a plurality of electrodes, including at least a first electrode having a first main-body electrode portion, a second electrode having a second main-body electrode portion, a third electrode having a third main-body electrode portion, a fourth electrode having a fourth main-body electrode portion and a fifth electrode having a fifth main-body electrode portion; wherein said first main-body electrode portion, said second main-body electrode portion, said third main-body electrode portion, said fourth main-body electrode portion and said fifth main-body electrode portion each further comprises at least two electrode tab portions; wherein said first main-body electrode portion, said third main-body electrode portion and said fifth main-body electrode portion are substantially the same size; wherein said second main-body electrode portion and said fourth main-body electrode portion are substantially the same size; wherein said third main-body electrode portion is larger than said second main-body electrode portion; wherein said third main-body electrode portion is stacked in-between said second main-body electrode portion and said fourth main-body electrode portion, and wherein said third electrode main-body electrode portion at least shields said second main-body electrode portion from said fourth main-body electrode portion; wherein said second main-body electrode portion, said third main-body electrode portion and said fourth main-body electrode portion are stacked in-between said first main-body electrode portion and said fifth main-body electrode portion; wherein said first main-body electrode portion, said third main-body electrode portion and said fifth main-body electrode portion are operable together to shield said second main-body electrode portion and said fourth main-body electrode portion from any other main-body electrode portion of said plurality of electrodes; a plurality of conductive material portions including at least a first conductive material portion, a second conductive material portion, a third conductive material portion and a fourth conductive material portion; wherein a first electrode tab portion of said at least two electrode tab portions of said second main-body electrode portion of said second electrode is adjacent a first electrode tab portion of said at least two electrode tab portions of said fourth main-body electrode portion of said fourth electrode, and wherein said first electrode tab portion of said second electrode is conductively connected to said first electrode tab portion of said fourth electrode by said first conductive material portion; wherein a second electrode tab portion of said at least two electrode tab portions of said second main-body electrode portion of said second electrode is adjacent a second electrode tab portion of said at least two electrode tab portions of said fourth main-body electrode portion of said fourth electrode, and wherein said second electrode tab portion of said second electrode is conductively connected to said second electrode tab portion of said fourth electrode by said second conductive material portion; wherein a first electrode tab portion of said at least two electrode tab portions of said first main-body electrode portion of said first electrode, a first electrode tab portion of said at least two electrode tab portions of said third main-body electrode portion of said third electrode and a first electrode tab portion of said at least two electrode tab portions of said fifth main-body electrode portion of said fifth electrode are conductively connected together by said third conductive material portion; wherein a second electrode tab portion of said at least two electrode tab portions of said first main-body electrode portion of said first electrode, a second electrode tab portion of said at least two electrode tab portions of said third main-body electrode portion of said third electrode and a second electrode tab portion of said at least two electrode tab portions of said fifth main-body electrode portion of said fifth electrode are conductively connected together by said fourth conductive material portion; wherein said first electrode tab portion of said second electrode is located on an opposite side of said second main-body electrode portion from said second electrode tab portion of said second electrode, and wherein said first electrode tab portion of said second electrode is offset relative to said second electrode tab portion of said second electrode; and wherein said first electrode tab portion of said fourth electrode and said second electrode tab portion of said fourth electrode are on opposite sides of said fourth main-body electrode portion, and wherein said first electrode tab portion of said fourth electrode is offset relative to said second electrode tab portion of said fourth electrode.
 2. The energy conditioner of claim 1, wherein a dielectric material separates said first main-body electrode portion, said second main-body electrode portion, said third main-body electrode portion, said fourth main-body electrode portion and said fifth main-body electrode portion from one another, and wherein said dielectric material covers said first main-body electrode portion, said second main-body electrode portion, said third main-body electrode portion, said fourth main-body electrode portion and said fifth main-body electrode portion.
 3. The energy conditioner of claim 2, wherein said second main-body electrode portion and said fourth main-body electrode portion are operable as shielded main-body electrode portions when said energy conditioner is energized.
 4. A circuit that includes the energy conditioner of claim
 2. 5. An energy conditioner comprising: at least a plurality of conductive pathways, including a first, a second, a third, a fourth and a fifth conductive pathway; wherein said first conductive pathway has a first main-body electrode with at least two opposing tab portions; wherein said second conductive pathway has a second main-body electrode with at least two opposing tab portions; wherein said third conductive pathway has a third main-body electrode with at least two opposing tab portions; wherein said fourth conductive pathway has a fourth main-body electrode with at least two opposing tab portions; and wherein said fifth conductive pathway has a fifth main-body electrode with at least two opposing tab portions; wherein said first main-body electrode, said third main-body electrode, and said fifth main-body electrode are substantially the same size and shape, and wherein said second main-body electrode and said fourth main-body electrode are substantially the same size and shape; wherein said first main-body electrode, said third main-body electrode, and said fifth main-body electrode are each larger than said second main-body electrode, and wherein said first main-body electrode, said third main-body electrode, and said fifth main-body electrode are each larger than said fourth main-body electrode; wherein said third main-body electrode is stacked in-between said second main-body electrode and said fourth main-body electrode, and wherein said second main-body electrode, said third main-body electrode and said fourth main-body electrode are stacked in-between said first main-body electrode and said fifth main-body electrode; wherein a dielectric material separates and conductively isolates each of said first, second, third, fourth and fifth main-body electrodes from one another; wherein a perimeter portion of said second main-body electrode and a perimeter portion of said fourth main-body electrode are in stacked alignment with one another; wherein said at least two opposing tab portions of said second main-body electrode are non-overlapped with said at least two opposing tab portions of said fourth main-body electrode; wherein a first tab of said at least two opposing tab portions of said first conductive pathway, a first tab of said at least two opposing tab portions of said third conductive pathway, and a first tab of said at least two opposing tab portions of said fifth conductive pathway are conductively connected to one another by a first conductive material portion; wherein a second tab of said at least two opposing tab portions of said first conductive pathway, a second tab of said at least two opposing tab portions of said third conductive pathway, and a second tab of said at least two opposing tab portions of said fifth conductive pathway are conductively connected to one another by a second conductive material portion; wherein a first tab of said at least two opposing tab portions of said second conductive pathway and a first tab of said at least two opposing tab portions of said fourth conductive pathway are conductively connected to one another by a third conductive material portion; and wherein a second tab of said at least two opposing tab portions of said second conductive pathway and a second tab of said at least two opposing tab portions of said fourth conductive pathway are conductively connected to one another by a fourth conductive material portion.
 6. The energy conditioner of claim 5, wherein a portion of said first conductive material portion and a portion of said second conductive material portion each conductively connect said first conductive pathway, said third conductive pathway, and said fifth conductive pathway to one another beyond a perimeter of said dielectric material.
 7. The energy conditioner of claim 6, wherein said first tab of said at least two opposing tab portions of said second conductive pathway and said first tab of said at least two opposing tab portions of said fourth conductive pathway are conductively connected to one another by a portion of said third conductive material portion located beyond said perimeter of said dielectric material.
 8. The energy conditioner of claim 7, wherein a perimeter portion of said first main-body electrode, a perimeter portion of said third main-body electrode, and a perimeter portion of said fifth main-body electrode are in stacked alignment with one another.
 9. The energy conditioner of claim 8, wherein said second conductive pathway and said fourth conductive pathway are operable together as a first energy pathway to a semiconductor chip; and wherein said first conductive pathway, said third conductive pathway and said fifth conductive pathway are operable together as a second energy pathway from said semiconductor chip.
 10. The energy conditioner of claim 8, wherein said second conductive pathway and said fourth conductive pathway are operable together as a first energy pathway from a semiconductor chip; and wherein said first conductive pathway, said third conductive pathway and said fifth conductive pathway are operable together as a second energy pathway to said semiconductor chip.
 11. A circuit that includes the energy conditioner and said semiconductor chip of claim
 9. 12. A circuit that includes the energy conditioner and said semiconductor chip of claim
 10. 13. The energy conditioner of claim 3, wherein said second electrode is operable for energy to transverse a first cross-over pathway from said first electrode tab portion of said second electrode to said second electrode tab portion of said second electrode when said energy conditioner is energized; and wherein said fourth electrode is operable for energy to transverse a second cross-over pathway from said first electrode tab portion of said fourth electrode to said second electrode tab portion of said fourth electrode when said energy conditioner is energized.
 14. The energy conditioner of claim 2, wherein said second electrode and said fourth electrode are operable together as a first energy pathway to a semiconductor chip; and wherein said first electrode, said third electrode and said fifth electrode are operable together as a second energy pathway from said semiconductor chip.
 15. The energy conditioner of claim 2, wherein said second electrode and said fourth electrode are operable together as a first energy pathway from a semiconductor chip; and wherein said first electrode, said third electrode and said fifth electrode are operable together as a second energy pathway to said semiconductor chip. 